Technology
- Capabilities
| |
Current |
Future |
| Maximum
Layers |
12 |
18 |
| Maximum
Board Thickness |
.180" |
.250" |
| Copper
Weight |
|
|
|
Inner Layers |
3 Ounces |
4 Ounces |
|
Outer Layers |
4 Ounces |
5 Ounces |
| Minimum
Line Width & Spacing |
|
|
|
Inner Layers |
.005"/.005" |
.003"/.003" |
|
Outer Layers |
.005"/.005" |
.003"/.003" |
| Maximum
Finished Board Size |
16" x 19" |
20" x 23" |
| Minimum
Core Thickness |
.004" |
.003" |
| Smallest
Hole Size |
.010" |
.008" |
| Minimum
Component Pitch |
10 mils |
8 mils |
| Aspect
Ratio |
11:01 |
15:01 |
| Via
Technology |
Blind & Buried Vias |
Blind, Buried & Macro Vias |
| Impedance
Control |
+/- 10% |
+/- 5% |
| Surface
Finishes |
HASL, Immersion Nickel/Gold, Deep Gold, Immersion Silver, White Tin, OSP |
HASL, Immersion Nickel/Gold, Deep Gold, Immersion Silver, White Tin, OSP |
| Materials |
FR402, FR406, Rogers 4000 Series, Polyimide, Teflon |
FR402, FR406, Rogers 4000 and 5000 Series, Polyimide, Teflon, Thermagon,
Cynate Ester, Getek |
| Special
Processes |
Counterbore, Countersink, Conductive/Non Conductive Via Plug |
Plasma Etchback, Counterbore, Countersink, Conductive/Non Conductive Via
Plug, Heatsinks, Imbedded Capacitance/ Resistance, Laser Drilling |
|
|
